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K4ABG165WA-MCTD
Manufacturer: Samsung
Technology: DDR4
Organization: x 16
Density: 32Gb
Speed:
Temperature: 0 ~ 85 °C
Package: 96 FBGA
K4AAG165WA-BCTD
Manufacturer: Samsung
Technology: DDR4
Organization: x 16
Density: 16Gb
Speed:
Temperature: 0 ~ 85 °C
Package: 96 FBGA
NT6AN512T32AV-J2
Manufacturer: Nanya
Technology: LPDDR4
Organization:
Density: 2GB
Speed:
Temperature:
Package: 200 ball
NT6AN1024F32AV-J2
Manufacturer: Nanya
Technology: LPDDR4
Organization:
Density: 4GB
Speed:
Temperature:
Package: 200 ball
NT6CL256M32AM-H1
Manufacturer: Nanya
Technology: LPDDR4
Organization:
Density: 1GB
Speed:
Temperature:
Package: 178ball
H5ANAG6NCJR-XNC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H5ANAG6NCMR-XNC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H5ANBG6NAMR-XNC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H54G26AYRQX066N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G26AYRVX066N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G36AYRQX246N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G36AYRQX264N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization: x 32
Density:
Speed:
Temperature: -40~105°C
Package:
H54G36AYRVX246N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G36AYRVX264N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G46BYYQX053N
Manufacturer: SK hynix
Technology: LPDDR4
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G46BYYQX085N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G46BYYVX053N
Manufacturer: SK hynix
Technology: LPDDR4
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G46BYYVX085N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G56BYYQX046N
Manufacturer: SK hynix
Technology: LPDDR4
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G56BYYQX089N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G56BYYVX046N
Manufacturer: SK hynix
Technology: LPDDR4
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G56BYYVX089N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
H54G66BYYQX104N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~105°C
Package:
H54G66BYYVX104N
Manufacturer: SK hynix
Technology: LPDDR4X
Organization:
Density:
Speed:
Temperature: -40~95°C
Package:
MT25QL128ABA1ESE-0SIT
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT28EW512ABA1LPC-0SIT
Manufacturer: Micron
Technology:
Density:
Width:
Voltage:
Package:
MT29F1G01ABAFDWB-IT:F
Manufacturer: Micron
Technology:
Density:
Width:
Voltage:
Package:
MT40A512M16LY-062E IT:E
Manufacturer: Micron
Technology: DDR4
Organization: x 16
Density: 8Gb
Speed:
Temperature: 0 ~ 85 °C
Package: 96 FBGA
MT41K64M16TW-107 IT:J
Manufacturer: Micron
Technology: DDR3
Organization: x 16
Density: 1Gb
Speed:
Temperature:
Package: 96 FBGA
MT41K64M16TW-107:J
Manufacturer: Micron
Technology: DDR3
Organization: x 16
Density: 1Gb
Speed:
Temperature:
Package: 96 FBGA
MT41K128M16JT-125 IT:K
Manufacturer: Micron
Technology: DDR3
Organization: x 16
Density: 2Gb
Speed:
Temperature:
Package: 96 FBGA
MT41K128M16JT-125:K
Manufacturer: Micron
Technology: DDR3
Organization: x 16
Density: 2Gb
Speed:
Temperature:
Package: 96 FBGA
MT41K256M16TW-107 IT:P
Manufacturer: Micron
Technology: DDR3
Organization: x 16
Density: 4G
Speed:
Temperature:
Package: 96 FBGA
MT41K256M16TW-107:P
Manufacturer: Micron
Technology: DDR3
Organization: x 16
Density: 4G
Speed:
Temperature:
Package: 96 FBGA
MT47H64M16NF-25E IT:M
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT48LC8M16A2P-6A:L
Manufacturer: Micron
Technology:
Density:
Width:
Voltage:
Package:
MT53E256M16D1DS-046 AAT:B
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H5AN4G6NBJR-UHC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H5AN4G8NBJR-VKC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H5AN8G6NCJR-VKC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
H5AN8G8NCJR-XNC
Manufacturer: SK hynix
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
K3LK4K40CM-BGCP
Manufacturer: Samsung
Technology: LPDDR5
Organization:
Density:
Speed: 6400 Mbps
Temperature:
Package:
K3LK6K60BM-BGCP
Manufacturer: Samsung
Technology:
Organization:
Density:
Speed: 6400 Mbps
Temperature:
Package:
K3LK7K70BM-BGCP
Manufacturer: Samsung
Technology:
Organization:
Density:
Speed: 6400 Mbps
Temperature:
Package:
K3LKBKB0BM-MGCP
Manufacturer: Samsung
Technology:
Organization:
Density:
Speed: 6400 Mbps
Temperature:
Package:
K3LKCKC0BM-MGCP
Manufacturer: Samsung
Technology:
Organization:
Density:
Speed: 6400 Mbps
Temperature:
Package:
K3LKDKD0CM-BGCP
Manufacturer: Samsung
Technology:
Organization:
Density:
Speed: 6400 Mbps
Temperature:
Package:
K4F6E3S4HM-MGCJ
Manufacturer: Samsung
Technology: LPDDR4
Organization: x 32
Density:
Speed:
Temperature:
Package:
K4F8E3S4HD-MGCL
Manufacturer: Samsung
Technology: LPDDR4
Organization: x 32
Density:
Speed:
Temperature:
Package:
K4F8E304HB-MGCJ
Manufacturer: Samsung
Technology: LPDDR4
Organization: x 32
Density:
Speed:
Temperature:
Package:
K4FBE3D4HM-MGCJ
Manufacturer: Samsung
Technology: LPDDR4
Organization: x 32
Density:
Speed:
Temperature:
Package:
K4FBE3D4HM-TFCL
Manufacturer: Samsung
Technology: LPDDR4
Organization: x 32
Density:
Speed:
Temperature:
Package:
K4U6E3S4AA-MGCL
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
K4U6E3S4AA-MGCR
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
K4U6E3S4AB-MGCL
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
K4UBE3D4AA-MGCL
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
K4UBE3D4AB-MGCL
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
K4UCE3Q4AA-MGCL
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
K4UCE3Q4AB-MGCL
Manufacturer: Samsung
Technology: LPDDR4X
Organization: x 32
Density:
Speed: 6400Mbps
Temperature:
Package:
KLM8G1GEUF-B04P
Manufacturer: Samsung
Technology: eMMC
Version: eMMC 5.1
Density: 8G
Temperature: -40 ~ 85 °C
Voltage: 1.8 / 3.3 V
Package: 153ball FBGA
KLM8G1GEUF-B04Q
Manufacturer: Samsung
Technology: eMMC
Version: eMMC 5.1
Density: 8G
Temperature: -40 ~ 105 °C
Voltage: 1.8 / 3.3 V
Package: 153ball FBGA
KLMAG2GEUF-B04P
Manufacturer: Samsung
Technology: eMMC
Version: eMMC 5.1
Density: 16GB
Temperature: -40 ~ 85 °C
Voltage: 1.8 / 3.3 V
Package: 153ball FBGA
KLMBG4GEUF-B04P
Manufacturer: Samsung
Technology: eMMC
Version: eMMC 5.1
Density: 32GB
Temperature: -40 ~ 85 °C
Voltage: 1.8 / 3.3 V
Package: 153ball FBGA
KLUDG4UHGC-B0E1
Manufacturer: Samsung
Technology: UFS
Version: UFS 3.1
Density: 128GB
Temperature: -25 ~ 85 °C
Voltage: 1.2 / 2.5 V
Package: 153ball FBGA
KLUEG4RHHD-B0G1
Manufacturer: Samsung
Technology: UFS
Version: UFS 3.1
Density: 256GB
Temperature: -25 ~ 85 °C
Voltage: 1.2 / 2.5 V
Package: 153ball FBGA
KLUEG8UHGB-B0E1
Manufacturer: Samsung
Technology: UFS
Version: UFS 3.1
Density: 256GB
Temperature: -25 ~ 85 °C
Voltage: 1.2 / 2.5 V
Package: 153ball FBGA
KLUFG8RHGB-B0E1
Manufacturer: Samsung
Technology: UFS
Version: UFS 3.1
Density: 512GB
Temperature: -25 ~ 85 °C
Voltage: 1.2 / 2.5 V
Package: 153ball FBGA
KLUGGARHDA-B0D1
Manufacturer: Samsung
Technology: UFS
Version: UFS 3.1
Density: 1TB
Temperature: -25 ~ 85 °C
Voltage: 1.2 / 2.5 V
Package: 153ball FBGA
MT29F2G01ABAGDWB-IT:G
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT29F2G08ABAEAWP-IT:E
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT29F2G08ABAEAWP:E
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT29F2G08ABAGAWP-IT:G
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT29F4G08ABAFAWP-IT:F
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT29F8G08ABACAWP-IT:C
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT29F8G08ABBCAH4-IT:C
Manufacturer: Micron
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
MT53D512M32D2DS-046 AAT:D
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53D512M32D2DS-053 WT:D
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53D1024M32D4DT-046 AIT:D
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53D1024M32D4DT-046 WT:D
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53D1024M32D4DT-053 WT:D
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53E1G32D2FW-046 WT:B
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53E1G32D2NP-046 WT:B
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53E256M32D2DS-053 WT:B
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
MT53E512M32D1ZW-046 WT:B
Manufacturer: Micron
Technology:
Organization:
Density:
Speed:
Temperature:
Package:
TC58BVG0S3HTA00
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58BVG1S3HBAI4
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58BVG1S3HTA00
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58CVG0S3HRAIJ
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58CVG2S0HRAIJ
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58NVG0S3HTA00
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58NVG1S3HBAI4
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58NVG1S3HBAI6
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58NVG1S3HTA00
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58NVG1S3HTAI0
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TC58NVG2S0HTA00
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TH58NVG3S0HTA00
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
TH58NVG3S0HTAI0
Manufacturer: Kioxia
Technology: Nand Flash
Density:
Width:
Voltage:
Package:
THGAMRG7T13BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMRG8T13BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMRG9T23BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMRT0T43BAIR
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMSG9T24BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMST0T24BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMVG7T13BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGAMVG8T13BAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGBMJG6C1LBAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGBMJG7C1LBAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGBMJG8C2LBAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGBMNG5D1LBAIL
Manufacturer: Kioxia
Technology: eMMC
Version:
Density:
Temperature:
Voltage:
Package:
THGBMTG5D1LBAIL
Manufacturer: Kioxia
Technology: eMMC
Version:
Density:
Temperature:
Voltage:
Package:
THGBMUG6C1LBAIL
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGJFAT1T84BAIR
Manufacturer: Kioxia
Technology:
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
THGJFGT2T85BAIR
Manufacturer: Kioxia
Technology: eMMC
Version: eMMC 5.1
Density:
Temperature:
Voltage:
Package:
KM8F9001JM-B813T07
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
KM8V9001JM-B813T01
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
KMDH6001DM-B422
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
KMDP6001DA-B425
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
KMDV6001DB-B625
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
KMDX60018M-B425
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
KMFN60012B-B214
Manufacturer: Samung
eStorage Density:
eStorage Version:
DRAM Density:
DRAM Type:
Package:
Speed:
...
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