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佰维(biwin) eMCP

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Issuing time:2024-01-30 11:48Author:glochip.comSource:www.globalizex.com/news/Link:https://www.glochip.com/news/

eMCP

随着手机所用操作系统的程序代码容量变大,特别是随着Android操作系统的广泛流行,智能型手机对存储容量的更高要求,BIWIN eMCP是基于MCP(Multi-Chip Packaging;多芯片封装技术)的产品,采用eMMC芯片加一颗低功耗的DRAM方案,有效简化了客户产品的制造过程和开发成本,缩短终端产品的研发时间,加快终端产品上市。

产品规格
接口eMMC+LPDDR4X
尺寸11.5x13x1.0mm/11.5x13x1.2mm
最大顺序读取速度320MB/s
最大顺序写入速度260MB/s
容量8GB+512MB/8GB+1GB/16GB+1GB/16GB+2GB/32GB+3GB/32GB+2GB/64GB+3GB/64GB+4GB/64GB+6GB/128GB+4GB/128GB+6GB
认证Spreadtrum:7731E;9832E;9820E;SC9850K;SC7731C;SC7731G;SC8825; SC9820;SC9832;SC9832A;SC9832E;SC9850;SC9853;SC9863A
Qualcomm:8909;APQ8009W;MSM8909W
MediaTek:MT6580; MT6735; MT6737; MT6739;MT6761;MT6570;MT6570N;MT6572;MT6735;M6735M;MT6737T;MT6753;MT67
工作电压eMMC:1.2V, 1.8V and 3.3V
Low power DDR4/4X:VDD1=1.8V; VDD2=VDDCA=VDDQ=1.2V VDD1=1.8V; VDD2=1.1V; VDDQ=1.1V or 0.6V
工作温度-20℃~85℃
封装方式FBGA162/FBGA221/FBGA254
应用方向智能手机 / 智能穿戴 / 教育电子 / 智能音箱 / 网通产品 / 平板


选型信息

32GB+32Gb

BWCC2KD6-32G


64GB+32Gb

BWCC2KD6-64G



Article classification: DRAM
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