News Detail

SAMSUNG: eMMC parts

52
Issuing time:2024-03-19 13:57Author:glochip.comSource:GlobalizeX.COMLink:https://www.glochip.com/news/
Version
Density
Voltage
Interface
Package Size
Temperature
Product Status
KLMCG1RCTE-B041
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMDG2RCTE-B041
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMCG2UCTB-B041
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMDG4UCTB-B041
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLM4G1FETE-B041
eMMC 5.1
4 GB
1.8 / 3.3 V
HS400
11 x 10 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLM8G1GEUF-B04P
eMMC 5.1
8 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 85 °C
Mass Production
KLM8G1GEUF-B04Q
eMMC 5.1
8 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 105 °C
Mass Production
KLMAG2GEUF-B04P
eMMC 5.1
16 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 85 °C
Mass Production
KLMAG2GEUF-B04Q
eMMC 5.1
16 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 105 °C
Mass Production
KLMBG4GEUF-B04P
eMMC 5.1
32 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 85 °C
Mass Production
KLMBG4GEUF-B04Q
eMMC 5.1
32 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-40 ~ 105 °C
Mass Production
KLM8G1GETF-B041
eMMC 5.1
8 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMAG1JETD-B041
eMMC 5.1
16 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMBG2JETD-B041
eMMC 5.1
32 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLMCG4JETD-B041
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLMCG4JEUD-B04P
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLMCG4JEUD-B04Q
eMMC 5.1
64 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLMDG8JEUD-B04P
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLMDG8JEUD-B04Q
eMMC 5.1
128 GB
1.8 / 3.3 V
HS400
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production


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