News Detail

SAMSUNG: LPDDR5 parts

115
Issuing time:2024-03-19 13:51Author:glochip.comSource:GlobalizeX.COMLink:https://www.glochip.com/news/
Density
Organization
Speed
Voltage
Temperature
Package
Product Status
K3LK4K40CM-BGCP
96 Gb
x64
6400 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
Mass Production
K3LKBKB0BM-MGCP
32 Gb
x32
6400 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
315 FBGA
Mass Production
K3LKDKD0CM-BGCP
144 Gb
x64
6400 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
Mass Production
K3LK6K60BM-BGCP
128 Gb
x64
6400 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
Mass Production
K3LK7K70BM-BGCP
64 Gb
x64
6400 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
Mass Production
K3LKCKC0BM-MGCP
64 Gb
x32
6400 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
315 FBGA
Mass Production
K3LK2K20BM-BGCN
48 Gb
x64
5500 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
EOL
K3LK3K30EM-BGCN
64 Gb
x64
5500 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
EOL
K3LK4K40BM-BGCN
96 Gb
x64
5500 Mbps
1.8 / 1.05 / 0.9 / 0.5 V
-25 ~ 85 °C
496 FBGA
EOL


Home                                    Product                                        News                                   About                                        Contact
Tel: +86-0755-84866816  13924645577
Tel: +86-0755-84828852  13924649321
Mail:  kevin@glochip.com
Web:  www.glochip.com
Rm401.1st Building, Dayun software Longgang Avenue, Longgang district,Shenzhen,China
Samsung Micron SKhynix Kingston Sandisk  Kioxia Nanya Winbond MXIC ESMT Longsys Biwin HosgingGlobal  BoyaMicro  Piecemakers Rayson  Skyhigh  Netsol

SRAM MRAM SDRAM DDR1 DDR2 DDR3 DDR4 DDR5 LPDDR3 LPDDR4 LPDDR4X LPDDR5 LPDDR5X NAND NOR eMMC UFS eMCP uMCP SSD Module