Product Detail

Skyhigh MCP

Collection
|
product warranty
Guarantee
Warranty
Delivery
Product details
Products Reviews(0)

NAND BASE MCP

Overview

SkyHigh Memory S6 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.


SkyHigh Memory MCP products is currently available in 8Gb SLC NAND +8Gb LPDDR4x configuration and is offered in small JEDECcompliant 149-ball BGA packages. This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.
MCP NAND Product OverviewPDF | 973 KB

NAND Base MCP Products Highlights

SLC NAND

  • Densities : 4Gb 8Gb IO width: x8

  • Voltages : 1.8V

  • Page Size : 2KB

  • Reliability : 100,000 P/E Cycles 10 years (typical)

  • ECC : 4bit ECC

LPDDR4x

  • Densities : 8Gb IO width: x16

  • Voltages : 1.8V, 1.1V

  • IO : 0.6V

  • Speed : 2133MHz

  • Bandwith : 4266Mb

Temperature

  • -40°C to +85°C

  • -40°C to +105°C

Package

  • 149-ball WFBGA 9.5 x 8 x 0.7 mm

Product Datasheets

Part NumberProduct StatusVoltageDensityI/O BusPackage DimensionDatasheet
SLC NANDDRAMSLC NANDDRAM NAND
S6AA8803Production1.8V8Gb8Gb816WBGA 149


Home                                    Product                                        News                                   About                                        Contact
Tel: +86-0755-84866816  13924645577
Tel: +86-0755-84828852  13924649321
Mail:  kevin@glochip.com
Web:  www.glochip.com
Rm401.1st Building, Dayun software Longgang Avenue, Longgang district,Shenzhen,China
Samsung Micron SKhynix Kingston Sandisk  Kioxia Nanya Winbond MXIC ESMT Longsys Biwin HosgingGlobal  BoyaMicro  Piecemakers Rayson  Skyhigh  Netsol

SRAM MRAM SDRAM DDR1 DDR2 DDR3 DDR4 DDR5 LPDDR3 LPDDR4 LPDDR4X LPDDR5 LPDDR5X NAND NOR eMMC UFS eMCP uMCP SSD Module